Comparative studies of cu and au electroless plating a review

Metal displacement reaction is a common method, well known and practiced world wide in decorative and electronic IndustriesElectroless plating has gained importance to satisfy the demands of the niche and gamet technologies.The chemical deposition of a metal from an aqueous bath solution of a salt, onto any other metal surface immersedin it, involves an electrochemical mechanism (oxidation and reduction reactions). The oxidation of a substance is characterized by the loss of electrons, while reduction is distinguished by a gain of electrons. Electroless nickel plating is the most commonly used plating method.Copper and gold are equally competent and are also used in electroless plating. Their physical and chemical properties, surface morphology, thickness characterization, applications and efficiency are significantly studied.