New tin-bismuth based lead free solder alloys with superior properties for industrial applications

Our research contained thermal behavior (DSC thermographs and thermal parameters), wetting properties (spreading behavior and contact angles), microstructure (x-ray analysis and scanning electron micrographs) and empirical solder applications (photo graphs of soldering electronic device) of new ternary tin- bismuth- X (X= Cu and Ag), quaternary tin- bismuth- X (X = Zn-In, Zn-Cu, Cu-In, Sb-In and Ag- In) and penta tin- bismuth- X (X=Ag-In-TiO2) solder alloys. Also it contained all measured physical properties (thermal, mechanical, electrical and soldering properties) of new tin- bismuth based alloys. The SnAg3.5Bi30In2 and SnAg3.5Bi30In2 (Tio2)1.5 alloys have best properties such as low coast, lower melting temperature (174 °C) contact angles (15 and 13°) and high strengthens (elastic modulus and Vickers hardness) compared to tin- lead commercial solder alloy for electronic industry. Significant decreased in melting temperature (~ 60 °C)of SnAg and SnCu alloys after adding alloying elements. Also all new tin- bismuth based lead free solder alloys have low melting temperature, high strengthens and adequate wetting behavior compared to tin- lead commercial solder alloy.