Our research contained thermal behavior (DSC thermographs and thermal parameters), wetting properties (spreading behavior and contact angles), microstructure (x-ray analysis and scanning electron micrographs) and empirical solder applications (photo graphs of soldering electronic device) of new ternary tin- bismuth- X (X= Cu and Ag), quaternary tin- bismuth- X (X = Zn-In, Zn-Cu, Cu-In, Sb-In and Ag- In) and penta tin- bismuth- X (X=Ag-In-TiO2) solder alloys. Also it contained all measured physical properties (thermal, mechanical, electrical and soldering properties) of new tin- bismuth based alloys. The SnAg3.5Bi30In2 and SnAg3.5Bi30In2 (Tio2)1.5 alloys have best properties such as low coast, lower melting temperature (174 °C) contact angles (15 and 13°) and high strengthens (elastic modulus and Vickers hardness) compared to tin- lead commercial solder alloy for electronic industry. Significant decreased in melting temperature (~ 60 °C)of SnAg and SnCu alloys after adding alloying elements. Also all new tin- bismuth based lead free solder alloys have low melting temperature, high strengthens and adequate wetting behavior compared to tin- lead commercial solder alloy.